Example of high aspect ratio laser penetration processing to SUS
Achieves high aspect ratio (7.5) laser through-hole machining for SUS.
This time, we will introduce an example of through-hole machining in SUS.
Through holes with a SUS (0.3 mm) emission diameter of 40 μm, a pitch of 300 μm, and an aspect ratio of 7.5 have been machined.
With a unique optical system and optical scanning, we have achieved a high-speed, low-distortion hole processing aspect ratio of 7.5, which was not possible with conventional construction methods.
Laser Processing Services
Our laser processing technology enables high-speed, non-contact processing of fine holes with significantly smaller diameters and fewer burrs compared to other drilling methods such as punch presses and etching.
Laser Processing Machine Manufacturing
We manufacture and sell roll-to-roll laser drilling machines equipped with our original optical system GHS (Grand Helical Scan).
Notice
We will inform you about various information, media publication information and exhibition exhibition information.
