2021/5/26 / Last updated : 2021/6/9 wired
Laser processing examplematerialMetalSheet Laser

Example of grooving to SUS

Grooving example for SUS: Wired Co., Ltd.
Laser groove processing was performed on S304 aiming at a groove width of 15 μm and a depth of 15 μm
Example of SUS groove processing (deep measurement): WIRED Co., Ltd.
Laser groove processing was performed on S304 aiming at a groove width of 15 μm and a depth of 15 μm

This is an introduction of a groove processing example for SUS304 using a single-wafer laser processing machine.
We processed SUS304 with a groove width of 15 μm and a depth of 15 μm.

If you are interested in this technology, please feel free to contact us.

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    About

    This is the corporate information page for Wired Co., Ltd.

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    Laser Processing Services

    Our laser processing technology enables high-speed, non-contact processing of fine holes with significantly smaller diameters and fewer burrs compared to other drilling methods such as punch presses and etching.

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    Laser Processing Machine Manufacturing

    We manufacture and sell roll-to-roll laser drilling machines equipped with our original optical system GHS (Grand Helical Scan).

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