Example of grooving to tungsten (W)
This is an introduction of a groove processing example for tungsten (W) using a single-wafer laser processing machine.
We processed tungsten with a groove width of 50 μm and a depth of 25 μm.
Laser Processing Services
Our laser processing technology enables high-speed, non-contact processing of fine holes with significantly smaller diameters and fewer burrs compared to other drilling methods such as punch presses and etching.
Laser Processing Machine Manufacturing
We manufacture and sell roll-to-roll laser drilling machines equipped with our original optical system GHS (Grand Helical Scan).
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