Hole Processing
Example of through-hole machining of titanium (Ti foil) with a single-wafer laser machining machine
This is an introduction of a laser through-hole machining example of Φ45 μm, pitch 500 μm (parallel type), and aperture ratio of 0.6% on a 12 μm thick titanium (Ti) foil using a single-wafer laser machining machine. Wired Co., Ltd.
