Hole Processing
Example of through-hole machining of titanium (Ti foil) with a single-wafer laser machining machine
This is an introduction of a laser through-hole machining example of Φ45 μm, pitch 500 μm (parallel type), and aperture ratio of 0.6% on a 12 μm thick titanium (Ti) foil using a single-wafer laser machining machine. Wired Co., Ltd.
Example of laser drilling on LIB positive electrode by sheet laser machining machine
Introduces examples of drilling holes in the LIB positive electrode using a sheet laser machine.
The LIB positive electrode (t = 130 μm) was machined with a hole diameter of 12 μm, a pitch of 110 μm (parallel), and an aperture ratio of 0.9%.
Processing with a roll-to-roll laser processing machine is also possible. WIRED Co., Ltd.
Example of laser drilling in LIB negative electrode by sheet laser machining machine
Introduces examples of drilling holes in the LIB negative electrode using a sheet laser machine.
The LIB negative electrode (t = 130 μm) was machined with a hole diameter of 16 μm, a pitch of 110 μm (parallel), and an aperture ratio of 1.5%.
Processing with a roll-to-roll laser processing machine is also possible. WIRED Co., Ltd.
Example of drilling holes in polyphenylene sulfide (PPS) using a sheet laser machine
This is an introduction of a case of penetrating polyphenylene sulfide (PPS) using a sheet laser machine.
Drilling was performed on PPS (t = 25 μm) with a hole diameter of 18 μm, a pitch of 155 μm (parallel type), and an aperture ratio of 1.1%. WIRED Co., Ltd.