Introduction of Selective Laser Punching Drawing Technology that is now controllable
In the hole punching technology with a diameter of 500 µm or more, which is a feature of the laser punching process technology, until now only high-speed batch laser continuous processing of film conveyed by roll-to-roll was possible. However, with the improvement of control functions, it is now possible to process any desired pattern on the film, enabling a variety of epoch-making patterns to be drawn. No need to make new plates or dies for each pattern.