High-speed punching technology for metal foil and resin film without using a die is a technology that simultaneously punches holes larger than the laser spot diameter in an instant, not in a single stroke. A special optical system is installed in the combination of film and laser conveyed by roll-to-roll.　　　　　　　　　　
As a result, an unprecedented functional film was created that enables simultaneous multi-punching and mass production at high speed.

A laser punches holes with diameters ranging from 50 µm to 1,000 µm, which far exceed the laser spot diameter, in metal foil and resin film that is conveyed by roll-to-roll, like a pressing process. There is no deformation of the material due to processing reaction force, and no shavings due to the thinness of the material. Laser punching can instantly punch about 300 holes at a time, making a significant contribution to SDGs in the world of organic synthesis and decomposition.