ロールtoロールでレーザー高速微細穴加工受託・レーザー加工機制作
This is an introduction of a laser through-hole machining example of Φ45 μm, pitch 500 μm (parallel type), and aperture ratio of 0.6% on a 12 μm thick titanium (Ti) foil using a single-wafer laser machining machine. Wired Co., Ltd.
This is an introduction of a case of penetrating copper (Cu) with a sheet laser machine.
Drilling was performed on Cu (t = 10 μm) with a hole diameter of 6 μm, a pitch of 30 μm (staggered arrangement), and an aperture ratio of 8.5%. WIRED Co., Ltd.
This is an introduction of a case of penetrating copper (Cu) with a sheet laser machine.
Drilling was performed on Cu (t = 10 μm) with a hole diameter of 6 μm, a pitch of 30 μm (staggered arrangement), and an aperture ratio of 8.5%. WIRED Co., Ltd.
Development of high-speed wide current collector laser processing equipment (mount), examination of high-speed wide current collector laser processing conditions, development of processing equipment (processing unit), burr, oxide fall-off prevention, development of deflection correction mechanism, development of inline defect detection mechanism. WIRED Co., Ltd.
